Extremely low power Bluetooth Audio SoC in a BGA package, designed for use in mid to entry-level truly wireless earbuds.
Optimized for use in earbuds and hearables, this single-chip solution is designed to elevate the truly wireless consumer experience and enable robust connectivity, all day wear* an....
Optimized for use in earbuds and hearables, this single-chip solution is designed to elevate the truly wireless consumer experience and enable robust connectivity, all day wear* an....
Optimized for use in earbuds and hearables, this single-chip solution is designed to elevate the truly wireless consumer experience and enable robust connectivity, all day wear* and comfort, integrated ANC, Voice Assistant support and premium wireless audio quality.
Optimized for use in earbuds and hearables, this single-chip solution is designed to elevate the truly wireless consumer experience and enable robust connectivity, all day wear* and comfort, integrated ANC, Voice Assistant support and premium wireless audio quality.
Qualcomm QCC3040 is a product of Qualcomm Technologies, Inc. and/or its subsidiaries.
* Battery life varies significantly with settings, usage, and other factors.
Our breakthrough ANC is designed to help provide high quality immersive experiences while at the same enabling natural leak-through of noise to allow for awareness of surroundings. Our ANC is totally integrated into this single-chip solution, helping to reduce the complexity, cost, and PCB space of adding ANC to earbuds and hearables by eliminating the need for a separate ANC chip.
Innovative new Qualcomm TrueWireless™ Mirroring technology is designed to further improve robustness and support dynamic bud-to-bud role-swapping with Bluetooth address handover while also evening out power distribution between both earbuds.
The QCC3040 offers support for push button voice activation for multiple voice ecosystems, helping OEMs to quickly, cost effectively and efficiently add voice assistant capability to mid and entry-level earbuds.
Extremely low-power performance
Qualcomm TrueWireless Mirroring technology for improved robustness and user experience
Bluetooth 5.0 radio
LE Audio ready
2 Mbps Bluetooth Low Energy support
Powerful tri-core processor architecture
2-ch 98dBA headset class D
2-ch 99dBA line inputs (single ended)
24-bit audio interfaces
Support for button press voice activation (multiple ecosystems)
Qualcomm® aptX™ audio
Integrated stacked flash (32Mbit)
BGA-90: 5.9mm x 5.6mm
CPU
CPU Clock Speed: Up to 32MHz
CPU Features: Programmable Apps CPU
CPU Architecture: 32-bit
DSP
DSP RAM: 80kB (P) + 256kB (D)
DSP Technology: 1x Qualcomm® Kalimba™ DSP, Configurable DSP
DSP Clock Speed: 1x 120 MHz DSP
Qualcomm® FastConnect™ Subsystem
Bluetooth Features: Bluetooth 5.0
Bluetooth
Bluetooth Technology: BLE Audio Ready, Bluetooth Low Energy sensor hub, Dual-mode Bluetooth
Bluetooth Speed: 2 Mbps
Voice Services
Digital Assistant Activation: Button press support for multiple voice eco-systems
General Audio
Audio Technology: Qualcomm TrueWireless™ Mirroring technology, Qualcomm® Active Noise Cancellation (ANC) technology, Qualcomm® aptX™ audio technology, Qualcomm® cVc™ audio technology
Qualcomm® aptX™ audio playback support: Qualcomm® aptX™ HD
Voice Services Support: Amazon Alexa Voice Service, Google Assistant (and others)
Qualcomm® Active Noise Cancelling (ANC) technology: Feedback, Feedforward, Hybrid
Qualcomm® cVc™ noise cancellation technology: 2-mic Headset, 2-mic Speaker, 1-mic Speaker, 1-mic Headset
Audio Playback
Channel output: Stereo
Power Consumption
Amperage: <5 mA
Package
Package Type: BGA
Pins: 90 pins
Pitch: 0.5mm Pitch
Package Size: 4.4 x 4.3mm
Qualcomm TrueWireless Mirroring, Qualcomm Kalimba, Qualcomm Active Noise Cancellation, Qualcomm FastConenct, Qualcomm aptX, and Qualcomm cVc are products of Qualcomm Technologies, Inc., and/or its subsidiaries.
| CPU Clock Speed | DSP Clock Speed | Digital Assistant Activation | Audio Technology | Amperage |
|---|---|---|---|---|
Up to 32MHz | 1x 120 MHz DSP | Button press support for multiple voice eco-systems | Qualcomm TrueWireless™ Mirroring technology Qualcomm® Active Noise Cancellation (ANC) technology Qualcomm® aptX™ audio technology Qualcomm® cVc™ audio technology | <5 mA |
Up to 32MHz | 1x 120 MHz DSP | Button press support for multiple voice eco-systems | Qualcomm TrueWireless™ Mirroring technology Qualcomm® Active Noise Cancellation (ANC) technology Qualcomm® aptX™ audio technology Qualcomm® cVc™ audio technology | <5 mA |
Up to 32MHz | 1x 120 MHz DSP | Button press | Qualcomm TrueWireless™ Stereo technology Qualcomm TrueWireless™ Stereo Plus technology Qualcomm® aptX™ audio technology Qualcomm® cVc™ audio technology | <7 mA |
Up to 32MHz | 1x 120 MHz DSP | Button press | Qualcomm® Broadcast Audio technology Qualcomm® aptX™ audio technology Qualcomm® cVc™ audio technology | <6 mA |
